YRH10
HOT
YRH10
- 半導體元件與SMD元件的混合貼裝
- 高速/高精度貼裝
- 支援電動送料器與充足的選配
- 可對應各種各樣的生產流程
基本規格
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YRH10 |
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對象基板尺寸 |
L50 x W30mm to L330 x W250mm |
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基板厚度 |
0.1 to 4.0mm |
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基板傳送方向 |
Left ⇒ Right (option : Right ⇒ Left) |
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傳送帶基準 |
Front |
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貼裝精度(Cpk ≧1.0) |
±15μm |
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貼裝能力 |
10,800 CPH (when die is supplied from wafer) Note : under optimum conditions |
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元件種類數量 |
Reel : Max. 48 types (conversion for 8mm tape feeder) Wafer : Max. 10 types |
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Die |
晶片尺吋 |
□0.35 to □16mm Note |
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晶片厚度 |
0.1 to 0.5mm Note |
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晶圓尺寸 |
6 to 8 inch wafers, 2 to 4 inch waffle trays |
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晶圓料盒 |
Wafer : Max. 10 types |
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SMD |
元件尺寸 |
0201 to □16mm, H15mm (multi camera) 0201 to □12mm, H6.5mm (scan camera) |
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料帶尺寸 |
8 to 104mm |
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最大feeder裝備配量 |
Max. 48 types (for 8mm feeder) |
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□0.35 to □16mm Note |
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電源規格 |
3-phase AC 200/208/220/240/380/400/416V ±10% 50/60Hz |
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供給氣源 |
0.45 MPa or more, in clean, dry state |
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外形尺寸 |
L1,252 x W1,962 x H1,853mm |
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主體重量 |
Approx. 1,560kg |
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規格、外觀如有變動，恕不另行通知。